OUR CORE PRODUCT
Ampashield-Thermal™, thanks to nano-carbon enabled chemistry, increases the effective surface area of a substrate to which it is applied that promotes cooling via thermal convection and also increases surface emissivity that provides superior cooling via thermal radiation.
Ampashield-Thermal™ has a “microcellular foam texture” that can be considered as highly emissive nano-heat sink. Product can be applied using conventional air spray technology, dip coating, aerosol spray or markers.
Ampashield-Plus™ has been introduced as an electrically conductive variation of our core product to combine thermal management with controllable sheet resistance making it especially attractive for any resistive conductors/heaters.
Ampashield-Plus™ provides sheet resistance at the level of 50Ω/sq. at 10μm
Product can be applied using conventional air spray technology, dip coating, aerosol spray or markers.
CAN BE APPLIED TO VARIETY OF SUBSTRATES ENABLING THEM TO HAVE ELECTRICAL CONDUCTIVITY
EASY TO APPLY BY CONVENTIONAL SPRAYING
(touch dry in less than 1 minute)
CAN BE USED TO PRODUCE FLEXIBLE RESISTIVE HEATERS
DOES NOT SUPPORT COMBUSTION AND AND DOES NOT DETERIORATE EASILY UNDER FIRE CONDITIONS
EXCELLENT ADHESION, BENDING AND IMPACT RESISTANCE
CAN BE USED TO PRODUCE FLEXIBLE
THERMAL MANAGEMENT EXAMPLES
Increasing current carrying capacity (ampacity) of copper conductors such as bus bars.
Case 1: Temperature of 25x0.7mm copper strip with and w/o coating under natural convection (no enclosure)
Case 2: Temperature of 25x0.7mm copper strip with and w/o coating under forced convection up to 3 m/s (200A, conductor inside 50 mm tube)
Case 3: Temperature of bare Cu conductor and metal enclosure under natural convection and 3 enclosure variants illustrated below
High ampacity Cu and Al bus bars
Low-profile heat exchangers
Passively-cooled embedded systems, e.g. LCD displays and other large electronics
High accuracy non-contact temperature measurements (using IR cameras)